i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1014N-r03 1 CPC1014N single-pole, normally open 4-lead sop optomos ? relay e 3 pb part # description CPC1014N 4-lead sop (100/tube) CPC1014Ntr 4-lead sop (2000/reel) parameter rating units blocking voltage 60 v p load current 400 ma rms / ma dc on-resistance (max) 2 ? led current to operate 2 ma applications features description ordering information pin configuration ? security ? passive infrared detectors (pir) ? data signalling ? sensor circuitry ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? aerospace ? industrial controls ? designed for use in security systems complying with en50130-4 ? 1500v rms input/output isolation ? small 4-lead sop package ? ttl/cmos compatible input ? arc-free with no snubbing circuits ? no emi/rfi generation ? immune to radiated em fields ? smd pick & place, wave solderable ? tape & reel version available the CPC1014N is a miniature single-pole, normally open (1-form-a) solid state relay in a 4-lead sop package that employs optically coupled mosfet technology to provide 1500v rms of input/output isolation. the super efficient mosfet switches and photovoltaic die use ixys integrated circuits division?s patented optomos architecture. the optically coupled output is controlled by a highly efficient gaalas infrared led. ixys integrated circuits division?s state of the art, double-molded vertical construction packaging makes the CPC1014N one of the world?s smallest relays. it offers board space savings of at least 20% over the competitor?s larger 4-lead sop relay. switching characteristics of normally open devices form-a i f i load 10% 90% t on t off approvals ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 1 2 3 4 + control C control load load free datasheet http://www.ndatasheet.com
i ntegrated c ircuits d ivision www.ixysic.com 2 r03 CPC1014N absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 60 v p reverse input voltage 5 v input control current peak (10ms) 50 ma 1a input power dissipation 70 mw total power dissipation 1 400 mw isolation voltage, input to output 1500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 3.33 mw / oc parameter conditions symbol min typ max units output characteristics load current continuous 1 i f =2ma i l - - 400 ma rms / ma dc peak t <10ms i lpk - - 1 a p on-resistance 2 i l =400ma r on --2 ? off-state leakage current v l =60v p i leak --1 a switching speeds turn-on i f =5ma, v l =10v t on - 0.47 2 ms turn-off t off - 0.22 1 output capacitance v l =50v, f=1mhz c out -40 - pf input characteristics input control current to activate 3 i l =400ma i f - 0.25 2 ma input control current to deactivate - i f 0.1 0.2 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r - - 10 a common characteristics capacitance, input to output - - - 1 - pf 1 load current derates linearly from 400ma @ 25 o c to 200ma @80 o c. 2 measurement taken within 1 second of on-time. 3 for applications requiring high temperature operation (greater than 60 o c) a led drive current of 4ma is recommended. electrical characteristics @ 25oc free datasheet http://www.ndatasheet.com
i ntegrated c ircuits d ivision CPC1014N www.ixysic.com 3 r03 performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. turn-on (ms) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 device count (n) 0 5 10 15 20 25 typical turn-on time (n=50, t a =25oc, i l =100ma, i f =5ma) turn-off (ms) 0.55 0.65 0.75 0.85 0.95 1.05 device count (n) 0 5 10 15 20 25 30 typical turn-off time (n=50, t a =25oc, i l =100ma, i f =5ma) on-resistance ( : ) 0.505 0.510 0.515 0.520 0.525 0.530 0.535 device count (n) 0 5 10 15 20 25 typical on-resistance distribution (n=50, t a =25oc, i l =400ma, i f =1ma) led current (ma) 0.16 0.18 0.20 0.22 0.24 0.26 0.28 device count (n) 0 5 10 15 20 25 typical i f for switch operation (n=50, t a =25oc, i l =400ma) led current (ma) 0.16 0.18 0.20 0.22 0.24 0.26 device count (n) 0 5 10 15 20 25 typical i f for switch dropout (n=50, t a =25oc, i l =400ma) blocking voltage (v p ) 63.5 64.0 64.5 65.0 65.5 66.0 66.5 device count (n) 0 5 10 15 20 25 30 35 typical blocking voltage distribution (n=50, t a =25oc) led forward voltage (v) 1.250 1.255 1.260 1.265 1.270 1.275 device count (n) 0 5 10 15 20 25 typical led forward voltage drop (n=50, t a =25oc, i f =5ma) led forward current (ma) turn-on (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-on vs. led forward current (i l =80ma) led forward current (ma) turn-off (ms) 0 5 1015202530354045 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 typical turn-off vs. led forward current (i l =80ma) time -40 -20 0 20 40 60 80 100 led forward voltage (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =50ma i f =20ma i f =10ma i f =5ma i f =2ma turn-on (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -20 0 20 40 60 80 100 temperature (oc) i f =5ma i f =10ma typical turn-on vs. temperature (i l =80ma) turn-off (ms) -40 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -20 0 20 40 60 80 100 typical turn-off vs. temperature (i l =80ma) temperature (oc) i f =5ma i f =10ma free datasheet http://www.ndatasheet.com
i ntegrated c ircuits d ivision www.ixysic.com 4 r03 CPC1014N performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.16 0.20 0.24 0.28 0.32 0.36 typical i f for switch operation vs. temperature (i l =200ma) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.28 typical i f for switch dropout vs. temperature (i l =200ma) 0.36 0.24 0.20 0.16 0.32 -40 0.9 0.8 0.7 0.6 0.5 0.4 0.3 -20 0 20 40 60 80 100 steady state on-resistance ( : ) temperature (oc) i f =5ma i f =10ma typical on-resistance vs. temperature (i l =200ma) load voltage (v) -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 load current (ma) -500 -400 -300 -200 -100 0 100 200 300 400 500 typical load current vs. load voltage (i f =2ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (ma) 0 100 200 300 400 500 maximum load current vs. temperature (i f =2ma) blocking voltage (v p ) -40 72 70 68 66 64 62 60 58 -20 0 20 40 60 80 100 typical blocking voltage vs. temperature temperature (oc) leakage (a) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 3&4 (v l =60v) temperature (oc) time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load current (ma) 0 100 200 300 400 500 600 700 800 900 1000 1100 energy rating curve (i f =2ma) free datasheet http://www.ndatasheet.com
i ntegrated c ircuits d ivision CPC1014N www.ixysic.com 5 r03 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating CPC1014N msl 3 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time CPC1014N 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb free datasheet http://www.ndatasheet.com
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1014N-r03 ?copyright 2012, ixys integrated circuits division optomos? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/13/2012 for additional information please visit our website at: www.ixysic.com 6 CPC1014N mechanical dimensions recommended pcb land pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) dimensions mm (inches) pin 1 4.089 0.203 (0.161 0.008) 2.54 typ (0.100 typ) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 0.200 0.025 (0.008 0.001) 1.02 0.025 (0.040 0.001) 2.184 max (0.086 max) 0.381 typ. (0.015 typ.) lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) dimensions mm (inches) note: all dimensional tolerances per standard eia-481-2 except as noted embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) u ser direction of feed user direction of feed k 0 =2.70 (0.106) k 1 =2.30 (0.091) b 0 =4.70 (0.185) w=12.00 (0.472) p=8.00 (0.315) a 0 =6.50 (0.256) CPC1014N CPC1014Ntr tape & reel free datasheet http://www.ndatasheet.com
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